CF3001

  CF3001 is an acid copper plating formulation that produces fine crystalline, stain and ductile deposits. it's specifically formulated for through hole plating of high reliability printed circuits and multilayer boards. Both the CF3001 process solution and deposits offer outstanding advantages.

  CF3001 affords simple operatration by means of one addition agent for ease of solution maintenance. This unique process is sulfur-free and therefore produces very ductile deposits with high elongation valuesand excellent thermal cycling performance.

  CF3001 is ideal for complex boards with plated through hole aspect ratios of 10:1 or greater.