OSP HT

    OSP HT organic solderability preservative (OSP) process is part of the OSP product line of high performance copper protective coatings for use on printed wiring boards(PWBs). This system will selectively coat copper pads and through holes with a durable film that maintains surface planarity and solderability even when subjected to multiple eutectic or lead free SMT thermal reflow cycles.  OSP  HT enables high reliability and consistently high solderjoint strength during electronic assembly.