CF1285

   CF1285 is a powdered material that is mixed with water and sulfuric acid to make a non-chelated, mild etch solution for copper. The primary function for the CF1285 is to provide a clean, uniformly microroughened copper surface on printed circuit boards prior to electroless and electrolytic copper and nickel.
   CF1285 operating solutions are specially formulated to be used in place of sulfuric/peroxide, ammonium persulfate, and sodium persulfate etching solutions. Comparative photographs of copper surfaces etched in CF1285 operating solutions and sulfuric/peroxide solutions included in this technical data sheet show the improved microroughened topography CF1285 generates. The micro-roughened topography provides superior adhesion of subsequent plating operations. When used prior to electrolytic plating, CF1285 aids in the removal of dry film binder residues that migrate into the copper-clad surface of printed circuit boards.