CF1150 is a three component system that when diluted with water, makes up anoperating solution to clean and micro etch copper surfaces. It provides optimum wetting along with a fast etch rate.
    CF1150 can be used in either spray or immersion applications.
    CF1150 is specifically designed as a one step cleaning process for use on copper surfaces of printed wiring boards prior to ENTEK PLUS CU-106A. It has been designed to deoxidize, wet and activate copper without leaving residues which cause ionic contamination problems. Also, this product can be used as a pre-treatment step for other applications where chemical cleaning is required such as hot air solder leveling, lamination of dry film, etc