CF2008 is a direct current acid copper system designed to meet the distribution
thermal cycle and throwing power requirements of today’s printed wiring
boards (PWBs), including high aspect ratio through-hole and microvia designs.
    The CF2008 system combines high current density capability with exceptional
surface distribution and throwing power. Significant improvements in plating
speed and deposit uniformity are achieved versus conventional direct current systems.
The product provides results similar to pulse periodic reverse plating systems.
The superior physical properties of the CF2008 system make it ideally suited for improved plated through-hole reliability, especially in the “lead-free” assembly
soldering environment where soldering temperatures may increase to >250˚C.