HSL Flux CF6863 is a heat stable flux used in hot air leveling machines which coat printed circuit boards with solder.

   This formula helps the solder to wet metal surfaces rapidly and actually assists the hot air leveling process by reducing surface tension on the solder . CF6863 is water soluble , non-foaming and can easily be removed by rinsing the printed circuit boards with water.

   CF6863 is low smoking and is heat stable at solder temperatures, producing a smooth bright finish with total copper edge coverage with minimum flux carbonization. CF6863 is a low corrosivity flux designed to meet the requirements of all hot air leveling equipment.